Uniformity¡¾3% across a 1" substrate by use of a unique magnetic circuit producing an extremely uniform erosion zone.
Low impedance head enables both RF erosion zone.
Adjustable target clamping allows target thickness from foils to 1/8".
The use of high strength rare earth magnets allows excellent target utilization at high deposition rates.
Quick, easy target change is accomplished by the use of a threaded clamp and anode shield.
Turbulent water flow provides uniform target cooling which minimizes thermal shock of ceramic materials.
Ultra-compact design makes this source ideal for multiple cathode deposition clusters or for use in small vacuum chambers.
All utilities are maintained at atmosphere and are accessed through a standard 1 inch "O"-ring compression fitting for ease of retrofit into any existing vacuum system.
Can be manufactured for external or internal mounts.
Extremely low operating pressure in the 10-4 range.
Operation Specifications
Maximum Sputtering Power : 150 Watts D.C. ; 75 Watts R.F.