Uniformity ¡¾3% across a 4" substrate by use of a unique magnetic circuit producing an extremely uniform erosion zone.
Low impedance head enables both RF erosion zone.
Adjustable target clamping allows target thickness from foils to 5/8".
The use of high strength rare earth magnets allows excellent target utilization at high deposition rates.
Quick, easy target change is accomplished by the use of a threaded clamp and anode shield.
Turbulent water flow provides uniform target cooling which minimizes thermal shock of ceramic materials.
Varying magnetic arrays are available which allow sputtering of magnetic materials up to 1/4" thick.
Ultra-compact design makes this source ideal for multiple cathode deposition clusters or for use in small vacuum chambers.
All utilities are maintained at atmosphere and are accessed through a standard 1 inch "O"-ring compression fitting for ease of retrofit into any existing vacuum system.
Can be manufactured for external or internal mounts.
Extremely low operating pressure in the 10-4 range.
Operation Specifications
Maximum Sputtering Power : 3000 Watts D.C. ; 1500 Watts R.F.