Final sort and inspection: This is one of the last steps in the long wafer manufacturing process. It is here that the wafers either meet or fail the specifications the customers (IC manufacturers) have asked for. There are many specifications the final prime wafers must meet according to agreements made between the customers and the Silicon manufacturer. We will talk about these specifications in a generalized form here, some specifications are tighter, some more relaxed depending on the end user and their requirements. Not including particles and other visual measurements most final sorting of wafers occurs on a automated system like the ADE 9650 pictured at the RIGHT. These compact systems can measure many different parameters including Thickness, Bow-Warp, TTV, Site & Global flatness, Type and Resistivity.