Next the finished Ingot
메인top
   
  
 
 
 
 

 

HOME< 자료실< 국외
 

Next the finished Ingot is ground to a rough size diameter (a little larger than a finished wafer) and it is either notched or flatted along it's length to indicate the orientation of the Ingot. This is also a point when many inspections are made on the ingot to catch any major flaws or problems with resistivity etc. The 200mm and 150mm ingots at the LEFT are freshly pulled and have not yet been ground, notched or flatted.


 
 
Total 20 건
번호 제  목 작성자 작성일 조회
20   Epitaxy 관리자 07-01-26 2737
19   Defects 관리자 07-01-26 3092
18   Resistivity 관리자 07-01-26 2922
17   Bow & Warp 관리자 07-01-26 3457
16   Site TIR or Total Indicator Reading 관리자 07-01-26 1791
15   Total Thickness Variation 관리자 07-01-26 1002
14   N-Type wafers 관리자 07-01-26 898
13   P-Type wafers 관리자 07-01-26 1505
12   Particles 관리자 07-01-26 810
11   Final sort and inspection 관리자 07-01-26 899
10   Final Cleaning 관리자 07-01-26 872
9   Polishing 관리자 07-01-26 938
8   Lapping 관리자 07-01-26 982
7   Slicing 관리자 07-01-26 863
  Next the finished Ingot 관리자 07-01-26 846
  
 1 2