Total Thickness Variation
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Total Thickness Variation is an important measurement done on Prime wafers at final inspection. It is done on a flatness checking machine like the ADE system pictured above. TTV represents the difference between the minimum and maximum thickness measured on the wafer. A typical number on a good 8" Prime wafer would be < 15 um (of course as you read this the art of wafer polishing is advancing and better and better TTV's are being reported). We have seen "test" wafers with high TTV's and a high Taper reading that look like a wedge


 
 
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20   Epitaxy 관리자 07-01-26 2736
19   Defects 관리자 07-01-26 3091
18   Resistivity 관리자 07-01-26 2922
17   Bow & Warp 관리자 07-01-26 3455
16   Site TIR or Total Indicator Reading 관리자 07-01-26 1790
  Total Thickness Variation 관리자 07-01-26 1002
14   N-Type wafers 관리자 07-01-26 897
13   P-Type wafers 관리자 07-01-26 1504
12   Particles 관리자 07-01-26 809
11   Final sort and inspection 관리자 07-01-26 899
10   Final Cleaning 관리자 07-01-26 872
9   Polishing 관리자 07-01-26 938
8   Lapping 관리자 07-01-26 981
7   Slicing 관리자 07-01-26 863
6   Next the finished Ingot 관리자 07-01-26 845
  
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